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Rapid increases in aerial densities of HDD (Hard Disk Drive) requires advanced patterning solutions for thin film head production.
This brings leading-edge semiconductor processes into the HDD industry as a breakthrough. The EMCP (Electro Magnetically Coupled Plasma) etch system provides superior performance in profile control as well as in higher etching rate and selectivity compared to conventional ion-milling processes.
|Applicable wafer diameter||150mm, 200mm|
|System configuration||2 etch+ 2 ash (max.)|